Surface Mount Assembly
Solder Paste Application
At Circor Solutions, this is one of the most important parts of the surface mount assembly process is the application of solder paste to the printed circuit board (PCB). The aim of this process is to accurately deposit the correct amount onto each of the pads to be soldered. This is achieved by screen-printing the solder paste through a stencil or foil.
Automated Surface Mount Assembly
At Circor Solutions PCBs population is done on a MYDATA pick and place machines and a reflow oven or belt reflow available for lead free applications. The MYDATA MY9 is capable of placing 18000 components per hour.
Contact us now at +27 21 762 1171 and we will gladly assist you!
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